ST72C334J4T6 STMicroelectronics, ST72C334J4T6 Datasheet - Page 143

• Manufacturer Part Number: ST72C334J4T6
• Description: MCU 8BIT FLASH SPI SCI 44TQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST72C334J4T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3.2 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Processor Series: ST72C3x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4 bit
• Operating Supply Voltage: 3.2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7C334-INDART, ST7MDT2-EPB2/US
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4838

17.2 SOLDERING AND GLUEABILITY INFORMATION
Recommended soldering information given only
as design guidelines in
Figure 105. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
Figure 106. Recommended Reflow Soldering Oven Profile (MID JEDEC)
Temp. [°C]
Temp. [°C]
250
200
150
100
250
200
150
100
50
50
0
0
PREHEATING
PHASE
Figure 105
ramp up
2°C/sec for 50sec
20
90 sec at 125°C
80°C
and
100
40
Figure
SOLDERING
PHASE
106.
60
5 sec
200
150 sec above 183°C
80
Recommended glue for SMD plastic packages
dedicated to molding compound with silicone:
Heraeus: PD945, PD955
Loctite: 3615, 3298
ST72334J/N, ST72314J/N, ST72124J
100
ramp down natural
2°C/sec max
COOLING PHASE
(ROOM TEMPERATURE)
Tmax=220+/-5°C
for 25 sec
300
120
140
400
160
Time [sec]
Time [sec]
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