UPD70F3737GF-GAS-AX Renesas Electronics America, UPD70F3737GF-GAS-AX Datasheet - Page 928

• Manufacturer Part Number: UPD70F3737GF-GAS-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3737GF-GAS-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

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On-chip debugging is debugging executed with the V850ES/JG3-L mounted on the target system.
By using MINICUBE2, on-chip debugging can be performed with a simple interface.
On-chip debugging can be performed for the V850ES/JG3-L by using the following two methods.
• Using the DCU (debug control unit)
• Not using the DCU
On-chip debugging is performed by the on-chip DCU in the V850ES/JG3-L, with the DRST, DCK, DMS, DDI, and
DDO pins used as the debug interface pins.
On-chip debugging can be performed by MINICUBE2, using the user resources instead of the DCU.
Target system
V850ES/JG3-L
Figure 31-1. On-Chip Debugging Using MINICUBE2
CHAPTER 31 ON-CHIP DEBUG FUNCTION
User’s Manual U18953EJ5V0UD
MINICUBE2