ST7FMC1K2B3 STMICROELECTRONICS [STMicroelectronics], ST7FMC1K2B3 Datasheet - Page 288

• Manufacturer Part Number: ST7FMC1K2B3
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ST7MC1xx/ST7MC2xx
PACKAGE CHARACTERISTICS (Cont’d)
13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
where P
the ports used in the application.
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Symbol
P
INT
T
R
Dmax
Jmax
thJA
is the chip internal power (I
Package thermal resistance (junction to ambient)
Maximum junction temperature
Power dissipation
2)
DD
x V
Ratings
DD
) and P
1)
PORT
LQFP80 14x14
LQFP64 14x14
LQFP44 10x10
SDIP32 400mil
SDIP56 600mil
LQFP32 7x7
is the port power dissipation depending on
D
= (T
J
-T
A
) / R
Value
thJA
150
500
55
55
68
80
63
45
.
D
=P
INT
+P
°C/W
Unit
mW
°C
PORT