D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 192

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
6. Bus Controller
Use the RLW bit in DRCRB to adjust the RAS signal width. A single refresh wait state (T
be inserted between the T
The RLW bit setting is valid only for CBR refresh cycles, and does not affect DRAM read/write
cycles. The number of states in the CBR refresh cycle is not affected by the settings in ASTCR,
WCRH, or WCRL, or by the state of the WAIT pin.
Figure 6.27 shows the timing when the TPC bit and RLW bit are both set to 1.
DRAM must be refreshed immediately after powering on in order to stabilize its internal state.
When using the H8/3006 and H8/3007 CAS-before-RAS refresh function, therefore, a DRAM
stabilization period should be provided by means of interrupts by another timer module, or by
counting the number of times bit 7 (CMF) of RTMCSR is set, for instance, immediately after bits
DRAS2 to DRAS0 have been set in DRCRA.
Rev.5.00 Sep. 12, 2007 Page 162 of 764
REJ09B0396-0500
(UCAS/LCAS)
Address bus
PB4/PB5
CS
RD(WE)
RFSH
n
Figure 6.27 CBR Refresh Timing (CSEL = 0, TPC = 1, RLW = 1)
(RAS)
AS
φ
R1
T
state and T
Rp1
R2
state by setting the RLW bit to 1.
T
RP2
Area 2 start address
High
High
T
R1
T
RW
T
R2
RW
) can

Related parts for D13007VX13V