D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 63

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Table 2.3
Instruction Size*
MOV
MOVFPE
MOVTPE
POP
PUSH
Note:
* Size refers to the operand size.
B: Byte
W: Word
L: Longword
B/W/L
B
B
W/L
W/L
Data Transfer Instructions
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register and
memory, or moves immediate data to a general register.
(EAs) → Rd
Cannot be used in this LSI.
Rs → (EAs)
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn.
Rn → @–SP
Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W
Rn, @–SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @–SP.
Rev.5.00 Sep. 12, 2007 Page 33 of 764
REJ09B0396-0500
2. CPU

Related parts for D13007VX13V