D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 311

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Pin
PB
UCAS
PB
TMIO
DREQ
4
3
/TP
/TP
3
/
1
12
11
/CS
/
/
4
Pin Functions and Selection Method
Bit NDER12 in NDERB and bit PB
PB
NDER12
Pin function
Note: * UCAS output depending on bits DRAS2 to DRAS0 in DRCRA and bit
CSEL in DRCRB, and regardless of bits NDER12 and PB
section 6, Bus Controller.
The DRAM interface settings by bits DRAS2 to DRAS0 in DRCRA, bits OIS3/2 and
OS1/0 in 8TCSR3, bits CCLR1 and CCLR0 in 8TCR3, bit CS4E in CSCR, bit
NDER11 in NDERB, and bit PB
DRAM interface
settings
OIS3/2 and
OS1/0
CS4E
PB
NDER11
Pin function
Notes: 1. TMIO3 input when CCLR1 = CCLR0 = 1.
DRAM interface
settings
DRAS2
DRAS1
DRAS0
4
3
DDR
DDR
2. When an external request is specified as a DMAC activation source,
3. CS4 is output as RAS
DREQ1 input regardless of bits OIS3 and OIS2, OS1 and OS0, CCLR1
and CCLR0, CS4E, NDER11, and PB3DDR.
DREQ
input
0
PB
0
PB
3
1
0
input*
4
0
input
1
output
2
3
PB
(1)
DDR select the pin function as follows.
4
1
0
0
0
.
4
3
DDR select the pin function as follows.
(1) in table below
All 0
0
1
output
TP
UCAS output*
TMIO
1
1
Rev.5.00 Sep. 12, 2007 Page 281 of 764
PB
11
1
4
3
output
1
0
input*
output
0
CS
1
1
4
4
0
DDR. For details, see
(2)
1
Not all 0
TMIO
output
1
TP
REJ09B0396-0500
3
12
0
output
1
1
8. I/O Ports
output*
1
below
(2) in
table
CS
(1)
1
4
3

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