D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 207

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

6.8.3
As with the basic bus interface, either program wait insertion or pin wait insertion using the WAIT
pin can be used in the initial cycle (full access) of the burst ROM interface.
Wait states cannot be inserted in a burst cycle.
Address bus
Data bus
Wait Control
φ
CS
AS
RD
0
Figure 6.40 Example of Burst ROM Access Timing
T
1
Full access
T
2
Read data
T
3
T
1
Rev.5.00 Sep. 12, 2007 Page 177 of 764
Read data
Only lower address changes
Burst access
T
2
T
1
Read data
REJ09B0396-0500
6. Bus Controller
T
2