D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 259

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Figure 7.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating*. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode and
normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the pin
is next sampled at the end of one block transfer.
Note: * The minimum response time is also four states when the DMAC is activated by an
φ
Address
bus
RD
HWR
LWR
,
internal module interrupt.
CPU cycle
T
1
T
2
T
d
T
1
Source
address
Figure 7.15 Burst DMA Bus Timing
T
2
T
Destination
address
1
T
2
T
DMAC cycle
1
T
2
Rev.5.00 Sep. 12, 2007 Page 229 of 764
T
1
T
2
T
1
T
2
T
1
7. DMA Controller
REJ09B0396-0500
T
2
T
CPU cycle
1
T
2