D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 616

• Manufacturer Part Number: D13007VX13V
• Description: MCU 3V 0K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13007VX13V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

20. Electrical Characteristics
Item
SCI
DMAC TEND delay
Rev.5.00 Sep. 12, 2007 Page 586 of 764
REJ09B0396-0500
Input
clock
cycle
Input clock rise
time
Input clock fall
time
Input clock
pulse width
Transmit data
delay time
Receive data
setup time
(synchronous)
Receive
data hold
time (syn-
chronous)
time 1
TEND delay
time 2
DREQ setup
time
DREQ hold
time
Asyn-
chronous
Syn-
chronous
Clock
input
Clock
output
Symbol Min
t
t
t
t
t
t
t
t
t
t
t
Scyc
SCKr
SCKf
SCKW
TXD
RXS
RXH
TED1
TED2
DRQS
DRQH
4
6
1.5
1.5
0.4
⎯
100
100
0
⎯
⎯
40
10
Condition
A
⎯
⎯
⎯
⎯
0.6
100
⎯
⎯
⎯
100
100
⎯
⎯
Max
Min
4
6
1.5
1.5
0.4
⎯
100
100
0
⎯
⎯
40
10
Condition
B
Max
⎯
⎯
⎯
⎯
0.6
100
⎯
⎯
⎯
100
100
⎯
⎯
Min
4
6
1.5
1.5
0.4
⎯
100
100
0
⎯
⎯
25
10
Condition
C
Max
⎯
⎯
⎯
⎯
0.6
100
⎯
⎯
⎯
50
50
⎯
⎯
Unit
t
t
t
t
t
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
cyc
cyc
Scyc
Test
Conditions
Figure 20.20
Figure 20.21
Figure 20.22,
figure 20.23
Figure 20.24