D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 584

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
18. Clock Pulse Generator
18.5.3
The DIVCR setting changes the φ frequency, so note the following points.
• Select a frequency division ratio that stays within the assured operation range specified for the
• All on-chip module operations are based on φ. Note that the timing of timer operations, serial
Rev.5.00 Sep. 12, 2007 Page 554 of 764
REJ09B0396-0500
clock cycle time t
operating frequency range, and ensure that φ does not fall below this lower limit.
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 19.4.3, Selection of Waiting Time for Exit
from Software Standby Mode.
Usage Notes
cyc
in the AC electrical characteristics. Set φmin to the lower limit of the

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