D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 602

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
20. Electrical Characteristics
Rev.5.00 Sep. 12, 2007 Page 572 of 764
REJ09B0396-0500
2. Given current consumption values are when all the output pins are made to unloaded
3. I
Connect the AV
respectively.
state and, furthermore, when the on-chip pull-up MOS is turned off under conditions
that V
Also, the aforesaid current consumption values are when V
max = 0.3 V under the condition of V
I
I
Also, the typ. values for current dissipation are reference values.
CC
CC
CC
max. (under normal operations) = 1.0 (mA) + 0.90 (mA/(MHz × V)) × V
max. (when using the sleeve)
max. (when the sleeve + module are standing by)
IH
min = V
CC
CC
– 0.5 V and V
and V
REF
pins to the V
IL
max = 0.5 V.
= 1.0 (mA) + 0.65 (mA/(MHz × V)) × V
= 1.0 (mA) + 0.45 (mA/(MHz × V)) × V
RAM
CC
≤ V
and connect the AV
CC
< 4.5 V.
IH
min = V
SS
pin to the V
CC
× 0.9 and V
CC
CC
CC
SS
,
× f
× f
× f
IL

Related parts for D13007VX13V