D13007VX13V Renesas Electronics America, D13007VX13V Datasheet - Page 306

MCU 3V 0K 100-TQFP

D13007VX13V

Manufacturer Part Number
D13007VX13V
Description
MCU 3V 0K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13007VX13V

Core Processor
H8/300H
Core Size
16-Bit
Speed
13MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
8. I/O Ports
Pin
PA
TCLKB/
TEND
Rev.5.00 Sep. 12, 2007 Page 276 of 764
REJ09B0396-0500
1
/TP
1
1
/
Pin Functions and Selection Method
Bit MDF in TMDR, bits TPSC2 to TPSC0 in 16TCR2 to 16TCR0 of the 16-bit timer,
bits CKS2 to CKS0 in 8TCR3 of the 8-bit timer, bit NDER1 in NDERA, and bit
PA
PA
NDER1
Pin function
Notes: 1. TCLKB input when MDF = 1 in TMDR, or TPSC2 = 1, TPSC1 = 0, and
8-bit timer
channel 3
settings
CKS2
CKS1
CKS0
1
1
DDR select the pin function as follows.
DDR
2. When an external request is specified as a DMAC activation source,
TPSC0 = 1 in any of 16TCR2 to 16TCR0, or bits CKS2 to CKS0 in
8TCR3 are as shown in (1) in the table below.
TEND
1
output regardless of bits PA
0
PA
1
0
input
(2)
0
TEND
0
TCLKB input*
PA
1
DDR and NDER1.
1
1
output
1
0
1
output*
1
1
2
(1)
TP
1
1
output
1
1

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