HD64F3337YCP16 Renesas Electronics America, HD64F3337YCP16 Datasheet - Page 578

• Manufacturer Part Number: HD64F3337YCP16
• Description: IC H8 MCU FLASH 60K 84PLCC
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300r

Specifications of HD64F3337YCP16

• Core Processor: H8/300
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: Host Interface, I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 74
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 84-PLCC
• Package: 84PLCC
• Family Name: H8
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 74
• Interface Type: HIF/I2C/SCI
• On-chip Adc: 8-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

22.3.5
1. The I/O ports retain their present states in software standby mode. Thus, current dissipation
Note: When a SLEEP instruction is executed in ROM, the current responsible for this bug also
546
caused by the output current is not reduced.
BSET
SLEEP
BSET
MOV. W
MOV. W
MOV. W
MOV. W
JSR
flows when a sleep mode transition is made. Therefore, to further reduce current
dissipation in sleep mode, also, software should be modified so that the SLEEP instruction
is executed in RAM when making a sleep mode transition.
Application Notes
#7, @SYSCR:8
#H' 0180, R0
R0, @H'FF00
#H' 5470, R0
R0, @H'FF02
@H'FF00
#7, @SYSCR:8
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; Set the SSBY bit
; Execute the SLEEP instruction
; Set the SSBY bit
; Write the “SLEEP” code (H'0180)
; to RAM
; Write the “RTS” code (H'5470)
; to RAM
; Subroutine branch to that location
* Registers and RAM addresses are arbitrary.
Replace the underlined part
(SLEEP instruction) with
the code shown below.