HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 479

IC SUPERH MPU ROMLESS 256BGA

HD6417750SBP200

Manufacturer Part Number
HD6417750SBP200
Description
IC SUPERH MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SBP200

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 2.07 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SBP200
Manufacturer:
HITACHI
0
Part Number:
HD6417750SBP200
Manufacturer:
RENESAS/瑞萨
Quantity:
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Bits 25 to 23—Area 5 Wait Control (A5W2–A5W0): These bits specify the number of wait
states to be inserted for area 5. For details on MPX interface setting, see table 13.6, MPX Interface
is Selected (Areas 0 to 6).
Bit 25: A5W2
0
1
Bits 22 to 20—Area 5 Burst Pitch (A5B2–A5B0): These bits specify the number of wait states to
be inserted from the second data access onward in a burst transfer with the burst ROM interface
selected.
Bit 22: A5B2
0
1
Bit 24: A5W1
0
1
0
1
Bit 21: A5B1
0
1
0
1
Bit 23: A5W0
0
1
0
1
0
1
0
1
Bit 20: A5B0
0
1
0
1
0
1
0
1
Inserted Wait States
0
1
2
3
6
9
12
15 (Initial value)
Wait States Inserted from Second
Data Access Onward
0
1
2
3
4
5
6
7 (Initial value)
Rev.7.00 Oct. 10, 2008 Page 393 of 1074
Burst Cycle (Excluding First Cycle)
Section 13 Bus State Controller (BSC)
Description
First Cycle
Description
RDY Pin
Ignored
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
REJ09B0366-0700
RDY Pin
Ignored
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled
Enabled

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