HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 118

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
4. Exception Handling
4.5
Figure 4.5 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
Rev.4.00 Aug. 20, 2007 Page 72 of 638
REJ09B0395-0400
SP−4
SP−3
SP−2
SP−1
SP (ER7) →
SP−4
SP−3
SP−2
SP−1
SP (ER7) →
Legend:
PC
PC
PC
CCR:
SP:
Notes: PC indicates the address of the first instruction that will be executed after return.
E
H
L
:
:
:
Bits 23 to 16 of program counter (PC)
Bits 15 to 8 of program counter (PC)
Bits 7 to 0 of program counter (PC)
Condition code register
Stack pointer
Registers must be saved in word or longword size at even addresses.
* Ignored at return.
Stack Status after Exception Handling
Before exception handling
Before exception handling
Figure 4.5 Stack after Completion of Exception Handling
Stack area
Stack area
b. Advanced mode
Pushed on stack
a. Normal mode
Pushed on stack
SP (ER7)
SP+1
SP+2
SP+3
SP+4
SP (ER7)
SP+1
SP+2
SP+3
SP+4
After exception handling
After exception handling
CCR
CCR
CCR
PC
PC
PC
PC
PC
H
L
E
H
L
*
Even address
Even address

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