HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 99
HD6413008VXI25
Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet
1.D13008VFBL25V.pdf
(688 pages)
Specifications of HD6413008VXI25
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
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2.9.4
The external address space is divided into eight areas (areas 0 to 7). Bus-controller settings
determine whether each area is accessed via an 8-bit or 16-bit data bus, and whether it is accessed
in two or three states. For details see section 6, Bus Controller.
Read
access
Write
access
φ
Address bus
AS
D
15
,
Access to External Address Space
to D
RD HWR LWR
Figure 2.18 Pin States during Access to On-Chip Supporting Modules
φ
Address bus
Internal read signal
Internal data bus
Internal write signal
Internal data bus
,
0
Figure 2.17 Access Cycle for On-Chip Supporting Modules
,
High
T
1
T state
1
High impedance
Address
Rev.4.00 Aug. 20, 2007 Page 53 of 638
T
Bus cycle
2
Address
T state
2
Read data
Write data
T
3
T state
3
REJ09B0395-0400
2. CPU
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