HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 447

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
1. Data write
2. Transfer from TDR to TSR
3. Serial data output
Note: When the ERS flag is set, it should be cleared until transfer of the last bit (D7 in LSB-first
I/O data
TXI (TEND
interrupt)
transmission, D0 in MSB-first transmission) of the retransmit data to be transmitted next has
been completed.
Figure 13.6 Relation Between Transmit Operation and Internal Registers
Ds
In case of normal transmission: TEND flag is set
In case of transmit error:
Da
Figure 13.7 Timing of TEND Flag Setting
Db
Dc
Data 1
Data 1
Data 1
TDR
Dd
De
12.5 etu
11.0 etu
Df
ERS flag is set
Steps 2 and 3 above are repeated until the
TEND flag is set.
(shift register)
Dg
Data 1
TSR
Rev.4.00 Aug. 20, 2007 Page 401 of 638
Dh
Dp
Data remains in TDR
Data 1
Guard time
13. Smart Card Interface
DE
REJ09B0395-0400
When GM = 0
When GM = 1
I/O signal
output

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