HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 530

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
19. Electrical Characteristics
Module Item
SCI
Chip output pin
Rev.4.00 Aug. 20, 2007 Page 484 of 638
REJ09B0395-0400
Input clock
cycle
Input clock rise time
Input clock fall time
Input clock pulse width
Transmit data delay time
Receive data setup time
(synchronous)
Receive data
hold time
(synchronous)
C
Asynchronous t
Synchronous
Clock input
Clock output
Figure 19.2 Output Load Circuit
R
H
Symbol Min
t
t
t
t
t
t
Scyc
SCKr
SCKf
SCKW
TXD
RXS
RXH
R
4
6
0.4
100
100
0
L
C = 90 pF: ports 4, 6, 8, A
C = 30 pF: ports 9, A, B, RESO
R = 2.4 k
R = 12 k
Input/output timing measurement levels
• Low: 0.8 V
• High: 2.0 V
A
Max
1.5
1.5
0.6
100
L
H
Condition
Ω
Min
4
6
0.4
100
100
0
Ω
B and C
Max Unit
1.5
1.5
0.6
100
t
t
t
t
t
ns
ns
ns
ns
cyc
cyc
cyc
cyc
Scyc
19
to A
Test
Conditions
Figure 19.14
Figure 19.15
0
, D
15
to D
8

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