HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 502

• Manufacturer Part Number: HD6413008VXI25
• Description: MCU 3V 0K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413008VXI25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

17. Clock Pulse Generator
17.5.3
The DIVCR setting changes the φ frequency, so note the following points.
• Select a frequency division ratio that stays within the assured operation range specified for the
• All on-chip module operations are based on φ. Note that the timing of timer operations, serial
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REJ09B0395-0400
clock cycle time t
operating frequency range. Ensure that φ is not below this lower limit.
communication, and other time-dependent processing differs before and after any change in
the division ratio. The waiting time for exit from software standby mode also changes when
the division ratio is changed. For details, see section 18.4.3, Selection of Waiting Time for Exit
from Software Standby Mode.
Usage Notes
cyc
in the AC electrical characteristics. Note that φ
min
= lower limit of the