HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 526

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
19. Electrical Characteristics
Table 19.5 Control Signal Timing
Condition:
Condition A: V
Condition B: V
Condition C: V
Item
RES setup time
RES pulse width
Mode programming setup
time
RESO output delay time
RESO output pulse width
NMI, IRQ setup time
NMI, IRQ hold time
NMI, IRQ pulse width
(in recovery from software
standby mode)
Rev.4.00 Aug. 20, 2007 Page 480 of 638
REJ09B0395-0400
T
specifications)
fmax = 25 MHz
fmax = 20 MHz
fmax = 25 MHz
a
CC
CC
CC
= −20°C to +75°C (regular specifications), T
= 3.0 to 3.6 V, AV
= 5.0 V ±10%, AV
= 5.0 V ±10%, AV
Symbol Min
t
t
t
t
t
t
t
t
RESS
RESW
MDS
RESD
RESOW
NMIS
NMIH
NMIW
CC
CC
CC
150
10
200
132
150
10
200
= 3.0 to 3.6 V, V
= 5.0 V ±10%, V
= 5.0 V ±10%, V
A
Max
50
Condition
REF
REF
REF
Min
150
10
200
132
150
10
200
= 3.0 to AV
= 4.5 to AV
= 4.5 to AV
B and C
a
= −40°C to +85°C (wide-range
Max
50
CC
CC
CC
, V
, V
, V
Unit
ns
t
ns
ns
t
ns
ns
ns
cyc
cyc
SS
SS
SS
= AV
= AV
= AV
Test Conditions
Figure 19.4
Figure 19.5
Figure 19.6
SS
SS
SS
= 0 V,
= 0 V,
= 0 V,

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