HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 26

• Manufacturer Part Number: HD6413008VXI25
• Description: MCU 3V 0K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413008VXI25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

Section 12 Serial Communication Interface
12.1 Overview........................................................................................................................... 321
12.2 Register Descriptions ........................................................................................................ 326
12.3 Operation .......................................................................................................................... 350
12.4 SCI Interrupts.................................................................................................................... 377
12.5 Usage Notes ...................................................................................................................... 378
Section 13 Smart Card Interface
13.1 Overview........................................................................................................................... 383
13.2 Register Descriptions ........................................................................................................ 386
13.3 Operation .......................................................................................................................... 391
Rev.4.00 Aug. 20, 2007 Page xxiv of xliv
REJ09B0395-0400
12.1.1 Features................................................................................................................ 321
12.1.2 Block Diagram..................................................................................................... 323
12.1.3 Pin Configuration................................................................................................. 324
12.1.4 Register Configuration......................................................................................... 325
12.2.1 Receive Shift Register (RSR) .............................................................................. 326
12.2.2 Receive Data Register (RDR) .............................................................................. 326
12.2.3 Transmit Shift Register (TSR) ............................................................................. 327
12.2.4 Transmit Data Register (TDR)............................................................................. 327
12.2.5 Serial Mode Register (SMR) ............................................................................... 328
12.2.6 Serial Control Register (SCR).............................................................................. 332
12.2.7 Serial Status Register (SSR) ................................................................................ 337
12.2.8 Bit Rate Register (BRR) ...................................................................................... 342
12.3.1 Overview.............................................................................................................. 350
12.3.2 Operation in Asynchronous Mode ....................................................................... 353
12.3.3 Multiprocessor Communication........................................................................... 362
12.3.4 Synchronous Operation........................................................................................ 369
12.5.1 Notes on Use of SCI ............................................................................................ 378
13.1.1 Features................................................................................................................ 383
13.1.2 Block Diagram..................................................................................................... 384
13.1.3 Pin Configuration................................................................................................. 385
13.1.4 Register Configuration......................................................................................... 385
13.2.1 Smart Card Mode Register (SCMR) .................................................................... 386
13.2.2 Serial Status Register (SSR) ................................................................................ 388
13.2.3 Serial Mode Register (SMR) ............................................................................... 389
13.2.4 Serial Control Register (SCR).............................................................................. 390
13.3.1 Overview.............................................................................................................. 391
13.3.2 Pin Connections ................................................................................................... 391
13.3.3 Data Format ......................................................................................................... 392
13.3.4 Register Settings .................................................................................................. 394
..................................................................................... 383
................................................................ 321