HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 490

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
16. RAM
16.1.1
Figure 16.1 shows a block diagram of the on-chip RAM.
16.1.2
The on-chip RAM is controlled by SYSCR. Table 16.2 gives the address and initial value of
SYSCR.
Table 16.2 System Control Register
H'EE012
Note:
Rev.4.00 Aug. 20, 2007 Page 444 of 638
REJ09B0395-0400
Address*
Note: * The lower 20 bits of the address are shown.
Legend:
SYSCR: System control register
* Lower 20 bits of the address in advanced mode.
Block Diagram
Register Configuration
System control register
Name
Figure 16.1 RAM Block Diagram
Even addresses
H'FFF1E*
H'FEF20*
H'FEF22*
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
On-chip RAM
Bus interface
SYSCR
Abbreviation
Odd addresses
H'FEF21*
H'FEF23*
H'FFF1F*
R/W
R/W
SYSCR
H'09
Initial Value

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