HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 528

• Manufacturer Part Number: HD6413008VXI25
• Description: MCU 3V 0K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413008VXI25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

19. Electrical Characteristics
Item
Write data hold time
Read data access time 1
Read data access time 2
Read data access time 3
Read data access time 4
Precharge time 1
Precharge time 2
Wait setup time
Wait hold time
Bus request setup time
Bus acknowledge delay
time 1
Bus acknowledge delay
time 2
Bus-floating time
Note: In order to secure the address hold time relative to the rise of the RD strobe, address
Rev.4.00 Aug. 20, 2007 Page 482 of 638
REJ09B0395-0400
update mode 2 should be used. For details see section 6.3.5, Address Output Method.
Symbol Min
t
t
t
t
t
t
t
t
t
t
t
t
t
WDH
ACC1
ACC2
ACC3
ACC4
PCH1
PCH2
WTS
WTH
BRQS
BACD1
BACD2
BZD
0.5 t
−15
⎯
⎯
⎯
⎯
1.0 t
−20
0.5 t
−20
25
5
25
⎯
⎯
⎯
cyc
cyc
cyc
A
Max
⎯
2.0 t
−45
3.0 t
−45
1.5 t
−45
2.5 t
−45
⎯
⎯
⎯
⎯
⎯
30
30
30
Condition
cyc
cyc
cyc
cyc
Min
0.5 t
−15
⎯
⎯
⎯
⎯
1.0 t
−20
0.5 t
−20
25
5
25
⎯
⎯
⎯
B and C
cyc
cyc
cyc
Max
⎯
2.0 t
−45
3.0 t
−45
1.5 t
−45
2.5 t
−45
⎯
⎯
⎯
⎯
⎯
30
30
30
cyc
cyc
cyc
cyc
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figure 19.7,
figure 19.8
Figure 19.9
Figure 19.10