HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 521

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Table 19.2 DC Characteristics (2)
Conditions: V
Item
Schmitt
trigger input
voltages
Input high
voltage
Input low
voltage
Output high
voltage
Output low
voltage
Input leakage
current
V
T
a
Port A,
P8
RES, STBY,
NMI, MD
MD
EXTAL
Port 7
Ports 4 to 6
P8
P9
RES, STBY,
MD
NMI, EXTAL,
ports 4 to 7
P8
P9
All output pins
(except RESO)
All output pins
(except RESO)
A
RESO
STBY, NMI,
RES,
MD
Port 7
CC
SS
= −40°C to +85°C (wide-range specifications)
0
= AV
= 3.0 to 3.6 V, AV
0
3
5
3
5
to A
, P8
, port B
, P8
, port B
0
2
2
to P8
to MD
to MD
19
4
4
SS
, P9
, P9
2
2
= 0 V*
to
0
0
0
0
to
to
Symbol
V
V
V
V
V
V
V
|I
1
, T
in
T
T
T
IH
IL
OH
OL
|
+
+
a
– V
CC
= −20°C to +75°C (regular specifications),
= 3.0 to 3.6 V, V
T
Min
V
V
V
V
V
V
−0.3
−0.3
V
V
CC
CC
CC
CC
CC
CC
CC
CC
× 0.2
× 0.05 ⎯
× 0.9
× 0.7
× 0.7
× 0.7
−0.5
−1.0
Typ
REF
Rev.4.00 Aug. 20, 2007 Page 475 of 638
= 3.0 V to AV
Max
V
V
V
AV
V
V
V
0.4
1.0
0.4
1.0
1.0
CC
CC
CC
CC
CC
CC
CC
× 0.7
+0.3
+0.3
+0.3
× 0.1
× 0.2
+0.3 V
19. Electrical Characteristics
CC
*
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
μA
μA
1
,
REJ09B0395-0400
Test
Conditions
I
I
I
I
I
V
V
V
AV
OH
OH
OL
OL
OL
in
CC
in
= 1.6 mA
= 5 mA
= 1.6 mA
= −200 μA
= −1 mA
= 0.5 V to
= 0.5 V to
CC
−0.5 V
−0.5 V

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