HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 503

• Manufacturer Part Number: HD6413008VXI25
• Description: MCU 3V 0K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD6413008VXI25

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

18. Power-Down State
Section 18 Power-Down State
18.1
Overview
The H8/3008 has a power-down state that greatly reduces power consumption by halting the CPU,
and a module standby function that reduces power consumption by selectively halting on-chip
modules.
The power-down state includes the following three modes:
• Sleep mode
• Software standby mode
• Hardware standby mode
The module standby function can halt on-chip supporting modules independently of the power-
down state. The modules that can be halted are the 16-bit timer, 8-bit timer, SCI0, SCI1, and A/D
converter.
Table 18.1 indicates the methods of entering and exiting the power-down modes and module
standby mode, and gives the status of the CPU and on-chip supporting modules in each mode.
Rev.4.00 Aug. 20, 2007 Page 457 of 638
REJ09B0395-0400