HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 627

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
NDERB—Next Data Enable Register B
NDERA—Next Data Enable Register A
Initial value
Initial value
Read/Write
Read/Write
Bit
Bit
NDER15
NDER7
R/W
R/W
7
0
7
0
NDER14
NDER6
R/W
R/W
Bits 7 to 0
Bits 7 to 0
NDER7
to NDER0
NDER15
to NDER8
6
0
6
0
0
1
0
1
NDER13
NDER5
R/W
R/W
5
0
5
0
TPC outputs TP
(NDR15 to NDR8 are not transferred to PB
TPC outputs TP
(NDR15 to NDR8 are transferred to PB
TPC outputs TP
TPC outputs TP
(NDR7 to NDR0 are not transferred to PA
(NDR7 to NDR0 are transferred to PA
Next data enable 15 to 8
Next data enable 7 to 0
NDER12
NDER4
R/W
R/W
4
0
4
0
15
15
7
7
to TP
to TP
to TP
to TP
NDER11
NDER3
Rev.4.00 Aug. 20, 2007 Page 581 of 638
Description
Description
R/W
R/W
H'FFFA2
H'FFFA3
3
0
3
0
0
0
8
8
are disabled
are enabled
are disabled
are enabled
Appendix B Internal I/O Registers
NDER10
NDER2
R/W
R/W
2
0
2
0
7
7
to PA
to PB
7
7
to PA
to PB
NDER9
NDER1
0
0
)
R/W
R/W
)
REJ09B0395-0400
1
0
1
0
0
0
)
)
NDER8
NDER0
R/W
R/W
0
0
0
0
TPC
TPC

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