EM357-MOD-LR-ANT-TG Ember, EM357-MOD-LR-ANT-TG Datasheet - Page 227

• Manufacturer Part Number: EM357-MOD-LR-ANT-TG
• Description: MODULE EM357 PA/LNA W/ANT TG
• Manufacturer: Ember

Specifications of EM357-MOD-LR-ANT-TG

• Frequency: 2.4GHz
• Data Rate - Maximum: 250kbps
• Modulation Or Protocol: 802.15.4 Zigbee
• Voltage - Supply: 2.1 V ~ 3.6 V
• Current - Receiving: 25mA
• Current - Transmitting: 42mA
• Data Interface: PCB, Surface Mount
• Memory Size: 192kB Flash, 12kB RAM
• Antenna Connector: On-Board, Chip
• Operating Temperature: -40°C ~ 85°C
• Package / Case: Module
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Applications: -
• Sensitivity: -
• Other names: 636-1020

19 Mechanical Details
19.1 QFN48 Footprint Recommendations
The EM35x package is a plastic 48-pin QFN that is 7 mm x 7 mm x 0.90 mm. Figure 19-1 illustrates the package
drawing.
Figure 19-2 demonstrates the IPC-7351 recommended PCB Footprint for the EM35x (QFN50P700X700X90-49N).
A ground pad in the bottom center of the package forms a 49
A 3 x 3 array of non-thermal vias should connect the EM35x decal center shown in Figure 19-2 to the PCB
ground plane through the ground pad. In order to properly solder the EM35x to the footprint, the Paste Mask
layer should have a 3 x 3 array of circular openings at 1.015 mm diameter spaced approximately 1.625 mm
(center to center) apart, as shown in Figure 19-3. This will cause an evenly distributed solder flow and
coplanar attachment to the PCB. The solder mask layer (illustrated in Figure 19-4) should be the same as the
copper layer for the EM35x footprint.
For more information on the package footprint, please refer to the appropriate EM35x Reference Design.
Figure 19-1. Package Drawing
Final
19-1
th
pin.
EM351 / EM357
120-035X-000G