AD9548/PCBZ Analog Devices Inc, AD9548/PCBZ Datasheet - Page 106

• Manufacturer Part Number: AD9548/PCBZ
• Description: Clock Generator Evaluation Board
• Manufacturer: Analog Devices Inc

Specifications of AD9548/PCBZ

• Silicon Manufacturer: Analog Devices
• Application Sub Type: Network Clock Generator/Synchronizer
• Kit Application Type: Clock & Timing
• Silicon Core Number: AD9548
• Kit Contents: Board
• Main Purpose: Timing, Clock Generator
• Embedded: No
• Utilized Ic / Part: AD9548
• Primary Attributes: 62.5 ~ 450 MHz Output Frequency
• Secondary Attributes: SPI and I2C Compatible Control Port
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD9548
THERMAL PERFORMANCE
Table 154. Thermal Parameters for the AD9548 88-Lead LFCSP Package
Symbol
θ
θ
θ
θ
θ
Ψ
1 The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.
2
The AD9548 is specified for a case temperature (T
ensure that T
Use the following equation to determine the junction tempera-
ture on the application PCB:
where:
T
T
the top center of the package.
Ψ
PD is the power dissipation (see the Power Dissipation section).
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.
JA
JMA
JMA
JB
JC
J
CASE
JT
JT
is the junction temperature (°C).
is the value as indicated in Table 154.
T
is the case temperature (°C) measured by the customer at
J
= T
CASE
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/s airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/s airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/s airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
CASE
+ (Ψ
is not exceeded, an airflow source can be used.
JT
× PD)
CASE
). To
Rev. A | Page 106 of 112
Values of θ
design considerations. θ
imation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of θ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
J
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
by the equation
1
JA
× PD)
JA
can be used for a first order approx-
Value
18
16
14
9
1.0
0.1
2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W