MT29F4G08ABADAWP:D Micron Technology Inc, MT29F4G08ABADAWP:D Datasheet - Page 13

• Manufacturer Part Number: MT29F4G08ABADAWP:D
• Description: MICMT29F4G08ABADAWP:D 4GB SLC NAND 34NM
• Manufacturer: Micron Technology Inc

Specifications of MT29F4G08ABADAWP:D

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 6: 63-Ball VFBGA (10.5mm x 13mm)
PDF: 09005aef83b25735
m60a_4gb_nand.pdf – Rev. G 11/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
63X Ø0.45
Seating
plane
0.12 A
8.8 CTR
0.8 TYP
A
Note:
10
1. All dimensions are in millimeters.
9
8
7
10.5 ±0.1
7.2 CTR
0.8 TYP
6
5
4
3
2
1
13
A
B
C
D
E
F
G
H
J
K
L
M
0.65 ±0.05
13 ±0.1
Ball A1 ID
4Gb, 8Gb: x8, x16 NAND Flash Memory
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Ball A1 ID
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.