MT29F4G08ABADAWP:D Micron Technology Inc, MT29F4G08ABADAWP:D Datasheet - Page 14

• Manufacturer Part Number: MT29F4G08ABADAWP:D
• Description: MICMT29F4G08ABADAWP:D 4GB SLC NAND 34NM
• Manufacturer: Micron Technology Inc

Specifications of MT29F4G08ABADAWP:D

• Lead Free Status / Rohs Status: Supplier Unconfirmed

Figure 7: 63-Ball VFBGA (9mm x 11mm)
PDF: 09005aef83b25735
m60a_4gb_nand.pdf – Rev. G 11/10 EN
Seating
Solder ball
material: SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.4
SMD ball pads.
plane
8.8 CTR
0.12 A
63X Ø0.45
0.8 TYP
A
Note:
10 9
1. All dimensions are in millimeters.
8
7
7.2 CTR
9 ±0.1
6
0.8 TYP
5
4
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
L
M
11 ±0.1
14
Ball A1 ID
4Gb, 8Gb: x8, x16 NAND Flash Memory
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
© 2009 Micron Technology, Inc. All rights reserved.
Ball A1 ID