MT48LC64M4A2 Micron Technology, MT48LC64M4A2 Datasheet - Page 61

• Manufacturer Part Number: MT48LC64M4A2
• Description: (MT48Lxxxx) SYNCHRONOUS DRAM
• Manufacturer: Micron Technology

NOTE: 1. All dimensions in millimeters.
256Mb: x4, x8, x16 SDRAM
256MSDRAM_E.p65 – Rev. E; Pub. 3/02
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
SEATING PLANE
2. Recommended Pad size for PCB is 0.33mm±0.025mm.
54X
6.40
0.10 C
0.35
3.20 ±0.05
BALL A9
0.700 ±0.075
C
3.20 ±0.05
8.00 ±0.10
6.40
C L
4.00 ±0.05
0.155 ±0.013
54-BALL, 8mm x 14mm
FBGA “FG” PACKAGE
1.80 ±0.05
CTR
C L
0.80 TYP
BALL A1
0.80 TYP
7.00 ±0.05
PIN A1 ID
14.00 ±0.10
61
1.00 MAX
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
256Mb: x4, x8, x16
PIN A1 ID
©2002, Micron Technology, Inc.
SDRAM