AT91SAM9261-CJ-999 Atmel, AT91SAM9261-CJ-999 Datasheet - Page 691
AT91SAM9261-CJ-999
Manufacturer Part Number
AT91SAM9261-CJ-999
Description
IC MCU ARM9 ULTRA LP 217LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet
1.AT91SAM9261-CJ-999.pdf
(749 pages)
Specifications of AT91SAM9261-CJ-999
Core Processor
ARM9
Core Size
16/32-Bit
Speed
190MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
DMA, LCD, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
32KB (32K x 8)
Program Memory Type
ROM
Ram Size
192K x 8
Voltage - Supply (vcc/vdd)
1.08 V ~ 1.32 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
217-LFBGA
For Use With
AT91SAM9261-EK - KIT EVAL FOR AT91SAM926EJ-SAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
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40.2
6062M–ATARM–23-Mar-09
Soldering Profile
Table 40-5
Table 40-5.
Note:
A maximum of three reflow passes is allowed per component.
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C.
gives the recommended soldering profile from J-STD-20.
Soldering Profile
AT91SAM9261 Preliminary
Green Package
3° C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 ° C
6° C/sec. max.
8 min. max.
691
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