PIC24FJ256DA206-I/MR Microchip Technology, PIC24FJ256DA206-I/MR Datasheet - Page 372

• Manufacturer Part Number: PIC24FJ256DA206-I/MR
• Description: MCU PIC 16BIT FLASH 256K 64VQFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ256DA206-I/MR

• Program Memory Type: FLASH
• Program Memory Size: 256KB (85.5K x 24)
• Package / Case: 64-VFQFN, Exposed Pad
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, GFX, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 96 KB
• Interface Type: UART, SPI, USB, I2C, RS-485, RS-232
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 5
• Operating Supply Voltage: 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, AC164127-4, AC164127-6, AC164139, DM240001, DM240312, DV164039
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ256DA210 FAMILY
30.1
FIGURE 30-1:
TABLE 30-1:
TABLE 30-2:
DS39969B-page 372
PIC24FJ256DA210 family:
Power Dissipation (with ENVREG = 1):
Maximum Allowed Power Dissipation
Package Thermal Resistance, 12x12x1 mm TQFP
Package Thermal Resistance, 10x10x1 mm TQFP
Package Thermal Resistance, 9x9x0.9 mm QFN
Package Thermal Resistance, 10x10x1.1 mm BGA
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation: P
I/O Pin Power Dissipation:
Note:
DC Characteristics
P
I
/
O
Junction to ambient thermal resistance, Theta-
=  ({V
V
CAP
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
(nominal On-Chip Regulator output voltage) = 1.8V.
DD
PIC24FJ256DA210 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
V
3.6V
2.2V
– V
BOR
Characteristic
OH
} x I
Rating
OH
) +  (V
INT
= V
OL
DD
x I
x (I
OL
DD
)
PIC24FJXXXDA1
–  I
Frequency
JA
OH
)
(
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX




P
T
T
JA
JA
JA
JA
A
D
J
69.4
76.6
28.0
40.2
Min
Typ
-40
-40
(T
JMAX
 2010 Microchip Technology Inc.
P
32 MHz
INT
Max
Typ
—
—
—
—
—
—
– T
+ P
2.2V
V
3.6V
A
I
BOR
/
)/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Note
Unit
°C
°C
W
W