PIC24FJ256DA206-I/MR Microchip Technology, PIC24FJ256DA206-I/MR Datasheet - Page 376

MCU PIC 16BIT FLASH 256K 64VQFN

PIC24FJ256DA206-I/MR

Manufacturer Part Number
PIC24FJ256DA206-I/MR
Description
MCU PIC 16BIT FLASH 256K 64VQFN
Manufacturer
Microchip Technology
Series
PIC® 24Fr
Datasheets

Specifications of PIC24FJ256DA206-I/MR

Program Memory Type
FLASH
Program Memory Size
256KB (85.5K x 24)
Package / Case
64-VFQFN, Exposed Pad
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, GFX, LVD, POR, PWM, WDT
Number Of I /o
52
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
96 KB
Interface Type
UART, SPI, USB, I2C, RS-485, RS-232
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
23
Number Of Timers
5
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, AC164127-4, AC164127-6, AC164139, DM240001, DM240312, DV164039
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC24FJ256DA210 FAMILY
TABLE 30-6:
DS39969B-page 376
DC CHARACTERISTICS
Power-Down Current (I
DC60D
DC60E
DC60H
DC60F
DC61D
DC61E
DC61H
DC61F
DC62D
DC62E
DC62H
DC62F
DC63D
DC63E
DC63H
DC63F
Note 1:
Parameter
No.
2:
3:
4:
Data in the Typical column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance
only and are not tested.
Base I
are configured as inputs and pulled high. WDT, etc., are all switched off, PMSLP bit is clear and the
Peripheral Module Disable (PMD) bits for all unused peripherals are set.
On-chip voltage regulator enabled (ENVREG tied to V
The  current is the additional current consumed when the module is enabled. This current should be
added to the base I
Typical
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
20.0
20.0
55.0
95.0
12.0
1.0
1.0
1.0
2.5
1.5
1.5
1.5
8.0
4.0
4.0
6.5
is measured with the device in Sleep mode (all peripherals and clocks are shut down). All I/Os
(1)
PD
)
(2)
PD
Max
105
185
3.5
3.5
3.5
6.5
current.
45
45
18
18
18
18
25
6
6
6
Standard Operating Conditions: 2.2V to 3.6V (unless otherwise stated)
Operating temperature
Units
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
+25°C
+60°C
+85°C
+25°C
+60°C
+85°C
+25°C
+60°C
+85°C
+25°C
+60°C
+85°C
-40°C
-40°C
-40°C
-40°C
DD
). Brown-out Reset (BOR) is enabled.
-40°C  T
3.3V
3.3V
3.3V
3.3V
(3)
(3)
(3)
(3)
A
 +85°C for Industrial
Conditions
PD
Base power-down current
31 kHz LPRC oscillator with
RTCC, WDT or Timer1:I
Low drive strength, 32 kHz crystal
with RTCC or Timer1: I
SOSCSEL<1:0> = 01
32 kHz crystal
with RTCC or Timer1: I
SOSCSEL<1:0> = 11
)
 2010 Microchip Technology Inc.
(4)
(4)
SOSC
SOSC
LPRC
(4)
;
;
(4)

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