HD64F2636UF20 Renesas Electronics America, HD64F2636UF20 Datasheet - Page 215

IC H8S MCU FLASH 128K 128QFP

HD64F2636UF20

Manufacturer Part Number
HD64F2636UF20
Description
IC H8S MCU FLASH 128K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2636UF20

Core Processor
H8S/2600
Core Size
16-Bit
Speed
20MHz
Connectivity
CAN, SCI, SmartCard
Peripherals
Motor Control PWM, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
H8S/2639, H8S/2638, H8S/2636,
H8S/2630, H8S/2635 Group
Table 7-3
ABWCR
ABWn
0
1
7.3.3
The chip's memory interfaces comprise a basic bus interface that allows direct connection or
ROM, SRAM, and so on, and a burst ROM interface that allows direct connection of burst ROM.
The memory interface can be selected independently for each area.
An area for which the basic bus interface is designated functions as normal space, and an area for
which the burst ROM interface is designated functions as burst ROM space.
REJ09B0103-0800 Rev. 8.00
May 28, 2010
Memory Interfaces
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
0
1
0
1
WCRH, WCRL
Wn0
0
1
0
1
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Access States
2
3
2
3
Section 7 Bus Controller
Program Wait
States
0
0
1
2
3
0
0
1
2
3
Page 165 of 1458

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