HD64F2636UF20 Renesas Electronics America, HD64F2636UF20 Datasheet - Page 841

• Manufacturer Part Number: HD64F2636UF20
• Description: IC H8S MCU FLASH 128K 128QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2636UF20

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI, SmartCard
• Peripherals: Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

H8S/2639, H8S/2638, H8S/2636,
H8S/2630, H8S/2635 Group
9. Before programming, check that the chip is correctly mounted in the PROM
10. Do not touch the socket adapter or chip during programming.
REJ09B0103-0800 Rev. 8.00
May 28, 2010
φ
V
FWE
MD2 to MD0
RES
SWE bit
Notes: 1. Except when switching modes, the level of the mode pins (MD2–MD0) must be fixed until power-
CC
programmer.
Overcurrent damage to the device can result if the index marks on the PROM programmer
socket, socket adapter, and chip are not correctly aligned.
Touching either of these can cause contact faults and write errors.
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit)
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
2. See section 24.1.7, Flash Memory Characteristics.
3. Mode programming setup time t
off by pulling the pins up or down.
*1
Figure 21A-18 Power-On/Off Timing (Boot Mode)
t
OSC1
t
MDS
SWE set
*2
t
*3
MDS
MDS
Wait time:
*3
(min.) = 200 ns
x
Program-
ming/
erasing
possible
Wait time:
100 μs
Min. 0 μs
SWE cleared
Min. 0 μs
Section 21A ROM
(H8S/2636 Group)
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