MT47H256M4BT-5E:A TR Micron Technology Inc, MT47H256M4BT-5E:A TR Datasheet - Page 6

• Manufacturer Part Number: MT47H256M4BT-5E:A TR
• Description: IC DDR2 SDRAM 1GBIT 5NS 92FBGA
• Manufacturer: Micron Technology Inc

Specifications of MT47H256M4BT-5E:A TR

• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (256M x 4)
• Speed: 5ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 92-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 557-1206-1

List of Tables
Table 1: Key Timing Parameters ...................................................................................................................... 2
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 17
Table 4: Input Capacitance ............................................................................................................................ 22
Table 5: Absolute Maximum DC Ratings ........................................................................................................ 23
Table 6: Temperature Limits .......................................................................................................................... 24
Table 7: Thermal Impedance ......................................................................................................................... 25
Table 8: General I
Table 9: I
Table 10: DDR2 I
Table 11: AC Operating Specifications and Conditions .................................................................................... 31
Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 41
Table 13: ODT DC Electrical Characteristics ................................................................................................... 42
Table 14: Input DC Logic Levels ..................................................................................................................... 43
Table 15: Input AC Logic Levels ..................................................................................................................... 43
Table 16: Differential Input Logic Levels ........................................................................................................ 44
Table 17: Differential AC Output Parameters .................................................................................................. 46
Table 18: Output DC Current Drive ................................................................................................................ 46
Table 19: Output Characteristics .................................................................................................................... 47
Table 20: Full Strength Pull-Down Current (mA) ............................................................................................ 48
Table 21: Full Strength Pull-Up Current (mA) ................................................................................................. 49
Table 22: Reduced Strength Pull-Down Current (mA) ..................................................................................... 50
Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 51
Table 24: Input Clamp Characteristics ........................................................................................................... 52
Table 25: Address and Control Balls ............................................................................................................... 53
Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 53
Table 27: AC Input Test Conditions ................................................................................................................ 54
Table 28: DDR2-400/533 Setup and Hold Time Derating Values (
Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (
Table 30: DDR2-400/533
Table 31: DDR2-667/800/1066
Table 32: Single-Ended DQS Slew Rate Derating Values Using
Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
Table 36: Truth Table – DDR2 Commands ..................................................................................................... 68
Table 37: Truth Table – Current State Bank n – Command to Bank n ............................................................... 69
Table 38: Truth Table – Current State Bank n – Command to Bank m .............................................................. 71
Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 72
Table 40: Burst Definition .............................................................................................................................. 76
Table 41: READ Using Concurrent Auto Precharge ......................................................................................... 96
Table 42: WRITE Using Concurrent Auto Precharge ....................................................................................... 102
Table 43: Truth Table – CKE ......................................................................................................................... 117
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
DD7
Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 27
DD
DD
Specifications and Conditions (Die Revisions E, G, and H) ................................................ 28
Parameters .................................................................................................................... 26
t
DS,
t
DH Derating Values with Differential Strobe ..................................................... 60
t
DS,
t
DH Derating Values with Differential Strobe ............................................ 61
6
t
DS
t
Micron Technology, Inc. reserves the right to change products or specifications without notice.
IS and
b
and
REF
REF
REF
t
) at DDR2-667 ..................................... 62
) at DDR2-533 ..................................... 63
) at DDR2-400 ..................................... 63
IS and
t
t
DH
IH) ................................................... 56
1Gb: x4, x8, x16 DDR2 SDRAM
b
.................................................. 62
t
IH) .......................................... 57
© 2004 Micron Technology, Inc. All rights reserved.