LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 10

• Manufacturer Part Number: LPC1769FBD100,551
• Description: IC ARM CORTEX MCU 512K 100-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1769FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC17
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 64 KB
• Interface Type: Ethernet, USB, OTG, CAN
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 8 Channel
• On-chip Dac: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4966; 935290522551

NXP Semiconductors
1.8 On-chip flash memory system
1.9 On-chip Static RAM
UM10360
User manual
Debug related options:
The LPC17xx contains up to 512 kB of on-chip flash memory. A flash memory accelerator
maximizes performance for use with the two fast AHB-Lite buses. This memory may be
used for both code and data storage. Programming of the flash memory may be
accomplished in several ways. It may be programmed In System via the serial port. The
application program may also erase and/or program the flash while the application is
running, allowing a great degree of flexibility for data storage field firmware upgrades, etc.
The LPC17xx contains up to 64 kB of on-chip static RAM memory. Up to 32 kB of SRAM,
accessible by the CPU and all three DMA controllers are on a higher-speed bus. Devices
containing more than 32 kB SRAM have two additional 16 kB SRAM blocks, each situated
on separate slave ports on the AHB multilayer matrix.
This architecture allows the possibility for CPU and DMA accesses to be separated in
such a way that there are few or no delays for the bus masters.
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A JTAG debug interface is included.
Serial Wire Debug is included. Serial Wire Debug allows debug operations using only
2 wires, simple trace functions can be added with a third wire.
The Embedded Trace Macrocell (ETM) is included. The ETM provides instruction
trace capabilities.
The Data Watchpoint and Trace (DWT) unit is included. The DWT allows data
address or data value matches to be trace information or trigger other events. The
DWT includes 4 comparators and counters for certain internal events.
An Instrumentation Trace Macrocell (ITM) is included. Software can write to the ITM in
order to send messages to the trace port.
The Trace Port Interface Unit (TPIU) is included. The TPIU encodes and provides
trace information to the outside world. This can be on the Serial Wire Viewer pin or the
4-bit parallel trace port.
A Flash Patch and Breakpoint (FPB) is included. The FPB can generate hardware
breakpoints and remap specific addresses in code space to SRAM as a temporary
method of altering non-volatile code. The FPB include 2 literal comparators and 6
instruction comparators.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 19 August 2010
Chapter 1: LPC17xx Introductory information
UM10360
© NXP B.V. 2010. All rights reserved.
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