LPC1769FBD100,551 NXP Semiconductors, LPC1769FBD100,551 Datasheet - Page 142
LPC1769FBD100,551
Manufacturer Part Number
LPC1769FBD100,551
Description
IC ARM CORTEX MCU 512K 100-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets
1.OM11043.pdf
(79 pages)
2.LPC1767FBD100551.pdf
(2 pages)
3.LPC1767FBD100551.pdf
(840 pages)
4.LPC1769FBD100551.pdf
(66 pages)
Specifications of LPC1769FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
70
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC17
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
Ethernet, USB, OTG, CAN
Maximum Clock Frequency
120 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB1760, MCB1760U, MCB1760UME
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
On-chip Dac
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4966
935290522551
935290522551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1769FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- OM11043 PDF datasheet
- LPC1767FBD100551 PDF datasheet #2
- LPC1767FBD100551 PDF datasheet #3
- LPC1769FBD100551 PDF datasheet #4
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NXP Semiconductors
10.3 Features
UM10360
User manual
Table 124. Ethernet acronyms, abbreviations, and definitions
Acronym or
Abbreviation
Frame
Half-word
LAN
MAC
MII
MIIM
Octet
Packet
PHY
RMII
Rx
TCP/IP
Tx
VLAN
WoL
Word
•
•
•
Ethernet standards support:
– Supports 10 or 100 Mbps PHY devices including 10 Base-T, 100 Base-TX,
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back
– Flexible transmit and receive frame options.
– VLAN frame support.
Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and prefetching.
Enhanced Ethernet features:
– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic FCS insertion (CRC) for transmit.
– Selectable automatic transmit frame padding.
100 Base-FX, and 100 Base-T4.
pressure.
All information provided in this document is subject to legal disclaimers.
Definition
An Ethernet frame consists of destination address, source address, length
type field, payload and frame check sequence.
16-bit entity
Local Area Network
Media Access Control sublayer
Media Independent Interface
MII management
An 8-bit data entity, used in lieu of "byte" by IEEE 802.3
A frame that is transported across Ethernet; a packet consists of a preamble,
a start of frame delimiter and an Ethernet frame.
Ethernet Physical Layer
Reduced MII
Receive
Transmission Control Protocol / Internet Protocol. The most common
high-level protocol used with Ethernet.
Transmit
Virtual LAN
Wake-up on LAN
32-bit entity
Rev. 2 — 19 August 2010
Chapter 10: LPC17xx Ethernet
UM10360
© NXP B.V. 2010. All rights reserved.
142 of 840
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