LPC2458FET180,551 NXP Semiconductors, LPC2458FET180,551 Datasheet - Page 414

IC ARM7 MCU FLASH 512K 180TFBGA

LPC2458FET180,551

Manufacturer Part Number
LPC2458FET180,551
Description
IC ARM7 MCU FLASH 512K 180TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets

Specifications of LPC2458FET180,551

Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
136
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
180-TFBGA
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
32 bit
Data Ram Size
98 KB
Interface Type
CAN, Ethernet, I2C, I2S, IrDA, SPI, SSP, UART, USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
136
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, SAB-TFBGA180
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
On-chip Dac
10 bit, 1 Channel
Package
180TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
For Use With
622-1023 - BOARD SCKT ADAPTER FOR TFBGA180622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4258
935282454551
LPC2458FET180-S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC2458FET180,551
Manufacturer:
MICROCHIP
Quantity:
1 103
Part Number:
LPC2458FET180,551
Manufacturer:
NXP Semiconductors
Quantity:
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NXP Semiconductors
UM10237_4
User manual
Fig 61. State transitions implemented in software during B-device switching from peripheral to host
Note that only the subset of B-device HNP states and state transitions supported by
hardware are shown. Software is responsible for implementing all of the HNP states.
Figure 15–61
polled, but this is not necessary if the corresponding interrupt is enabled.
Following are code examples that show how the actions in
accomplished. The examples assume that ISP1302 is being used as the external OTG
transceiver.
Remove D+ pull-up
/* Remove D+ pull-up through ISP1302 */
OTG_I2C_TX = 0x15A; // Send ISP1302 address, R/W=0
OTG_I2C_TX = 0x007; // Send OTG Control (Clear) register address
OTG_I2C_TX = 0x201; // Clear DP_PULLUP bit, send STOP condition
no
no
when host sends SET_FEATURE
HNP_SUCCESS set?
may appear to imply that the interrupt bits such as REMOVE_PU should be
HNP_FAILURE set?
with b_hnp_enable,
set B_HNP_TRACK
set PU_REMOVED
REMOVE_PU set?
remove D+ pull-up,
b_peripheral
b_wait_acon
b_host
go to
go to
yes
Rev. 04 — 26 August 2009
yes
no
yes
Chapter 15: LPC24XX USB OTG controller
add D+ pull-up
b_peripheral
go to
Figure 15–61
UM10237
© NXP B.V. 2009. All rights reserved.
are
414 of 792

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