C8051F066-GQ Silicon Laboratories Inc, C8051F066-GQ Datasheet - Page 39

MCU 8-Bit C8051F06x 8051 CISC 32KB Flash 3.3V 100-Pin TQFP

C8051F066-GQ

Manufacturer Part Number
C8051F066-GQ
Description
MCU 8-Bit C8051F06x 8051 CISC 32KB Flash 3.3V 100-Pin TQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F06xr
Datasheets

Specifications of C8051F066-GQ

Package
100TQFP
Device Core
8051
Family Name
C8051F06x
Maximum Speed
25 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
8 Bit
Number Of Programmable I/os
59
Interface Type
I2C/SMBus/SPI/UART
On-chip Adc
2-chx16-bit
Number Of Timers
5
Ram Size
4.25 KB
Program Memory Size
32 KB
Program Memory Type
Flash
Operating Temperature
-40 to 85 °C
Core Processor
8051
Core Size
8-Bit
Speed
25MHz
Connectivity
EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
59
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
336-1221

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F066-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F066-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
4.
MONEN
VREF0
DGND
AGND
XTAL1
XTAL2
Name
AVDD
VREF
/RST
VDD
TMS
TDO
TCK
AV+
TDI
Pinout and Package Definitions
37, 64,
38, 63,
10, 14,
11, 16,
17, 23
F060
F062
100
90
89
24
13
96
97
98
99
26
27
28
21
4
26, 40,
27, 39,
19, 22
Pin Numbers
7, 10,
6, 11,
F061
F063
55
54
18
23
52
53
56
57
58
20
21
63
61
15
37, 64,
38, 63,
11, 16,
10, 14,
17, 23
F064
F066
100
90
89
24
13
96
97
98
99
26
27
28
21
4
26, 40,
27, 39,
19, 22
7, 10,
6, 11,
F065
F067
55
54
18
23
52
53
56
57
58
20
21
63
61
15
Table 4.1. Pin Definitions
D Out JTAG Test Data Output with internal pull-up. Data is
A Out Crystal Output. This pin is the excitation driver for a
A Out Bandgap Voltage Reference Output
D I/O Device Reset. Open-drain output of internal VDD
Type Description
A I/O Bandgap Voltage Reference Output for ADC0.
D In
D In
D In
D In
A In
Rev. 1.2
Digital Supply Voltage. Must be tied to +2.7 to
+3.6 V.
Digital Ground. Must be tied to Ground.
Analog Supply Voltage. Must be tied to +2.7 to
+3.6 V.
Analog Supply Voltage. Must be tied to +2.7 to
+3.6 V.
Analog Ground. Must be tied to Ground.
JTAG Test Mode Select with internal pull-up.
JTAG Test Clock with internal pull-up.
JTAG Test Data Input with internal pull-up. TDI is
latched on the rising edge of TCK.
shifted out on TDO on the falling edge of TCK. TDO
output is a tri-state driver.
monitor. Is driven low when VDD is <2.7 V and
MONEN is high. An external source can initiate a
system reset by driving this pin low.
Crystal Input. This pin is the return for the internal
oscillator circuit for a crystal or ceramic resonator.
For a precision internal clock, connect a crystal or
ceramic resonator from XTAL1 to XTAL2. If over-
driven by an external CMOS clock, this becomes
the system clock.
crystal or ceramic resonator.
VDD Monitor Enable. When tied high, this pin
enables the internal VDD monitor, which forces a
system reset when VDD is < 2.7 V. When tied low,
the internal VDD monitor is disabled. Recom-
mended configuration is to connect directly to VDD.
ADC0 Voltage Reference Input.
C8051F060/1/2/3/4/5/6/7
39

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