C8051F066-GQ Silicon Laboratories Inc, C8051F066-GQ Datasheet - Page 5

• Manufacturer Part Number: C8051F066-GQ
• Description: MCU 8-Bit C8051F06x 8051 CISC 32KB Flash 3.3V 100-Pin TQFP
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F06xr

Specifications of C8051F066-GQ

• Package: 100TQFP
• Device Core: 8051
• Family Name: C8051F06x
• Maximum Speed: 25 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 59
• Interface Type: I2C/SMBus/SPI/UART
• On-chip Adc: 2-chx16-bit
• Number Of Timers: 5
• Ram Size: 4.25 KB
• Program Memory Size: 32 KB
• Program Memory Type: Flash
• Operating Temperature: -40 to 85 °C
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 59
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 2x16b
• Oscillator Type: Internal
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 336-1221

15. Oscillators ............................................................................................................. 171
16. Flash Memory ....................................................................................................... 177
17. External Data Memory Interface and On-Chip XRAM........................................ 187
18. Port Input/Output.................................................................................................. 203
15.1.Programmable Internal Oscillator ................................................................... 171
15.2.External Oscillator Drive Circuit...................................................................... 173
15.3.System Clock Selection.................................................................................. 173
15.4.External Crystal Example ............................................................................... 175
15.5.External RC Example ..................................................................................... 175
15.6.External Capacitor Example ........................................................................... 175
16.1.Programming The Flash Memory ................................................................... 177
16.2.Non-volatile Data Storage .............................................................................. 178
16.3.Security Options ............................................................................................. 179
17.1.Accessing XRAM............................................................................................ 187
17.2.Configuring the External Memory Interface .................................................... 188
17.3.Port Selection and Configuration.................................................................... 188
17.4.Multiplexed and Non-multiplexed Selection.................................................... 190
17.5.Memory Mode Selection................................................................................. 192
17.6.Timing .......................................................................................................... 194
18.1.Ports 0 through 3 and the Priority Crossbar Decoder..................................... 205
14.7.1.Enable/Reset WDT ................................................................................ 166
14.7.2.Disable WDT .......................................................................................... 166
14.7.3.Disable WDT Lockout ............................................................................ 166
14.7.4.Setting WDT Interval .............................................................................. 166
16.3.1.Summary of Flash Security Options....................................................... 183
17.1.1.16-Bit MOVX Example ........................................................................... 187
17.1.2.8-Bit MOVX Example ............................................................................. 187
17.4.1.Multiplexed Configuration....................................................................... 190
17.4.2.Non-multiplexed Configuration............................................................... 191
17.5.1.Internal XRAM Only ............................................................................... 192
17.5.2.Split Mode without Bank Select.............................................................. 192
17.5.3.Split Mode with Bank Select................................................................... 193
17.5.4.External Only.......................................................................................... 193
17.6.1.Non-multiplexed Mode ........................................................................... 196
17.6.2.Multiplexed Mode ................................................................................... 199
18.1.1.Crossbar Pin Assignment and Allocation ............................................... 205
18.1.2.Configuring the Output Modes of the Port Pins...................................... 206
18.1.3.Configuring Port Pins as Digital Inputs................................................... 207
18.1.4.Weak Pull-ups ........................................................................................ 207
17.6.1.1.16-bit MOVX: EMI0CF[4:2] = ‘101’, ‘110’, or ‘111’......................... 196
17.6.1.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘101’ or ‘111’..... 197
17.6.1.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘110’....................... 198
17.6.2.1.16-bit MOVX: EMI0CF[4:2] = ‘001’, ‘010’, or ‘011’......................... 199
17.6.2.2.8-bit MOVX without Bank Select: EMI0CF[4:2] = ‘001’ or ‘011’..... 200
17.6.2.3.8-bit MOVX with Bank Select: EMI0CF[4:2] = ‘010’....................... 201
Rev. 1.2
C8051F060/1/2/3/4/5/6/7
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