AMD-K6-IIIE+550ACR AMD (ADVANCED MICRO DEVICES), AMD-K6-IIIE+550ACR Datasheet - Page 344
AMD-K6-IIIE+550ACR
Manufacturer Part Number
AMD-K6-IIIE+550ACR
Description
Manufacturer
AMD (ADVANCED MICRO DEVICES)
Datasheet
1.AMD-K6-IIIE550ACR.pdf
(370 pages)
Specifications of AMD-K6-IIIE+550ACR
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AMD-K6™-IIIE+ Embedded Processor Data Sheet
322
Figure 120 shows the airflow management in a system using the
ATX form-factor. The orientation of the power supply fan and
the motherboard are modified in the ATX platform design. The
power supply fan pulls cool air through the chassis and across
the processor. The processor is located near the power supply
fan, where it can receive adequate airflow without an auxiliary
fan. The arrangement significantly improves the airflow across
the processor with minimum installation cost.
Figure 120. Airflow Path in an ATX Form-Factor System
For more information about thermal design considerations, see
the AMD-K6
Note, order# 21085.
Main Board
Preliminary Information
®
Thermal Design
Processor Thermal Solution Design Application
Drive Bays
F
n
a
P/S
23543A/0—September 2000
Chapter 17
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