XC2VP7-5FFG896I Xilinx Inc, XC2VP7-5FFG896I Datasheet - Page 332

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XC2VP7-5FFG896I

Manufacturer Part Number
XC2VP7-5FFG896I
Description
IC FPGA VIRTEX-II PRO 896-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet

Specifications of XC2VP7-5FFG896I

Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
396
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
896-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
FF1704 Flip-Chip Fine-Pitch BGA Package
As shown in
package. Following this table are the
Table 13: FF1704 — XC2VP70, XC2VPX70, and XC2VP100
DS083 (v4.7) November 5, 2007
Product Specification
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
R
Table
13, XC2VP70 and XC2VP100 Virtex-II Pro devices are available in the FF1704 flip-chip fine-pitch BGA
Virtex-II Pro Devices
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L27P_0/VREF_0
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L05_0/No_Pair
IO_L02N_0
IO_L03N_0
IO_L06N_0
IO_L07N_0
IO_L08N_0
IO_L09N_0
IO_L19N_0
IO_L20N_0
IO_L21N_0
IO_L25N_0
IO_L26N_0
IO_L27N_0
IO_L28N_0
IO_L29N_0
IO_L30N_0
IO_L02P_0
IO_L06P_0
IO_L07P_0
IO_L08P_0
IO_L19P_0
IO_L20P_0
IO_L21P_0
IO_L25P_0
IO_L26P_0
IO_L28P_0
IO_L29P_0
IO_L30P_0
Pin Description
FF1704 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
www.xilinx.com
(if Different)
XC2VPX70
Pin Number
M30
G34
H34
E34
C34
D34
K32
H33
G33
E33
D33
H32
E32
C33
C32
K31
H31
G31
D31
E31
K30
G30
H30
F34
F33
F32
L31
F31
L30
J33
J32
J31
J30
XC2VPX70
XC2VP70,
No Connects
pitch).
XC2VP100
Module 4 of 4
204

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