MCHC908GR8CFAE Freescale Semiconductor, MCHC908GR8CFAE Datasheet - Page 13

IC MCU FLSH 8BIT8MHZ 7.5K32-LQFP

MCHC908GR8CFAE

Manufacturer Part Number
MCHC908GR8CFAE
Description
IC MCU FLSH 8BIT8MHZ 7.5K32-LQFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheets

Specifications of MCHC908GR8CFAE

Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM
Number Of I /o
21
Program Memory Size
7.5KB (7.5K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Controller Family/series
HC08
No. Of I/o's
21
Ram Memory Size
384Byte
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08G
Core
HC08
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8.2 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Operating Supply Voltage
2.7 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908GZ60E, M68CBL05CE, M68EML08GPGTE
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 6 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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MC68HC908GR8 — Rev 4.0
MOTOROLA
16.7
17.1
17.2
17.3
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
19.1
19.2
19.3
19.4
19.5
19.6
19.7
19.8
Freescale Semiconductor, Inc.
Section 18. Serial Communications Interface (SCI)
For More Information On This Product,
Port E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 229
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232
Pin Name Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .250
SCI During Break Module Interrupts. . . . . . . . . . . . . . . . . . . . 251
I/O Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 251
I/O Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 271
SIM Bus Clock Control and Generation . . . . . . . . . . . . . . . . . 275
Reset and System Initialization. . . . . . . . . . . . . . . . . . . . . . . . 276
SIM Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 281
Exception Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 282
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .290
SIM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 293
Section 19. System Integration Module (SIM)
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Table of Contents
Section 17. RAM
Table of Contents
Technical Data
13

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