M29W640GB60ZA6E NUMONYX, M29W640GB60ZA6E Datasheet - Page 36

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M29W640GB60ZA6E

Manufacturer Part Number
M29W640GB60ZA6E
Description
Flash Mem Parallel 3V/3.3V 64M-Bit 8M x 8/4M x 16 60ns 48-Pin TFBGA Tray
Manufacturer
NUMONYX
Datasheet

Specifications of M29W640GB60ZA6E

Package
48TFBGA
Cell Type
NOR
Density
64 Mb
Architecture
Sectored
Block Organization
Asymmetrical
Location Of Boot Block
Bottom
Typical Operating Supply Voltage
3|3.3 V
Sector Size
8KByte x 8|64KByte x 127
Timing Type
Asynchronous
Operating Temperature
-40 to 85 °C
Interface Type
Parallel
Table 12.
1. Typical values measured at room temperature and nominal voltages.
2. Sampled, but not 100% tested.
3. Maximum value measured at worst case conditions for both temperature and V
4. This time does not include the pre-programming time.
5. Block erase polling cycle time (see
6. Maximum value measured at worst case conditions for both temperature and V
7. Program polling cycle time (see
36/90
Chip Erase
Block Erase (64 Kbytes)
Erase Suspend Latency Time
Program (byte or word)
Double Byte
Double Word /Quadruple Byte Program
Quadruple Word / Octuple Byte Program
Single Byte and Word Program
32-byte/16-word Program using Write to Buffer and Program
32-byte/16-word Program using Write to Buffer and Program
(V
Chip Program (byte by byte)
Chip Program (word by word)
Chip Program (Double Word/Quadruple Byte Program)
Chip Program (Quadruple Word/Octuple Byte Program)
Program Suspend Latency Time
Program/Erase Cycles (per block)
Data Retention
PP
/WP = 12 V)
Program, erase times and endurance cycles
(4)(5)
Parameter
(7)
Figure
Figure
6,
Figure 7
19).
and
Figure
19).
Symbol
t
t
WHWH2
WHWH1
CC
CC
100,000
.
Min
after 100,000 program/erase cycles.
20
Typ
180
0.5
10
40
80
10
10
10
10
45
80
20
10
(1)(2)
Max
400
200
200
200
200
400
200
100
50
50
4
(6)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(3)
(2)
cycles
years
Unit
μs
μs
μs
μs
μs
μs
μs
μs
μs
s
s
s
s
s
s

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