C8051T627-B-GM Silicon Labs, C8051T627-B-GM Datasheet - Page 33

• Manufacturer Part Number: C8051T627-B-GM
• Description: 8-bit Microcontrollers - MCU UBS, 64K OTP MCU
• Manufacturer: Silicon Labs

Specifications of C8051T627-B-GM

• Rohs: yes
• Core: 8051
• Processor Series: C8051T627
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 48 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 3328 B
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 5.25 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: QFN-32
• Mounting Style: SMD/SMT
• Program Memory Type: EPROM

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 3x3 array of 0.90mm openings on a 1.1 mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60 m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (67% Paste Coverage).
Body Components.
Figure 6.2. QFN-28 Recommended PCB Land Pattern
Table 6.2. QFN-28 PCB Land Pattern Dimensions
0.20
Min
C8051T620/1/6/7 & C8051T320/1/2/3
4.80
4.80
0.50
Max
0.30
Rev. 1.2
Dimension
X2
Y1
Y2
3.20
0.85
3.20
Min
3.30
Max
3.30
0.95
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