DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 978

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 22 Electrical Characteristics
Item
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time
Write data setup time
Write data hold time
WR setup time *
WR hold time *
CAS setup time *
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Note: * The DRAM interface is not supported in the H8S/2321.
Rev.6.00 Sep. 27, 2007 Page 946 of 1268
REJ09B0220-0600
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
WSW1
WSW2
WDD
WDS
WDH
WCS
WCH
WTS
WTH
WRD1
WRD2
CSR
BRQS
BACD
BZD
BRQOD
Min
1.0 ×
t
1.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
30
5
30
cyc
cyc
cyc
cyc
cyc
cyc
cyc
– 20
– 20
– 20
– 10
– 10
– 10
– 10
Condition A
Max
30
15
50
30
20
20
Min
1.0 ×
t
1.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
0.5 ×
t
25
5
30
cyc
cyc
cyc
cyc
cyc
cyc
cyc
– 15
– 15
– 15
– 8
– 10
– 10
– 8
Condition B
Max
20
15
40
25
15
15
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figure 22.10
Figure 22.8
Figure 22.14
Figure 22.15
Figures 22.6 to
22.13

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