HD6417709SF133B Renesas Electronics America, HD6417709SF133B Datasheet - Page 31

• Manufacturer Part Number: HD6417709SF133B
• Description: IC SUPERH MPU ROMLESS 208LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417709SF133B

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, FIFO, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 96
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 2.05 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -

Section 22 User Debugging Interface (UDI)
22.1 Overview ........................................................................................................................... 641
22.2 User Debugging Interface (UDI) ....................................................................................... 641
22.3 Register Descriptions......................................................................................................... 642
22.4 UDI Operation................................................................................................................... 651
22.5 Boundary Scan .................................................................................................................. 654
22.6 Usage Notes....................................................................................................................... 655
22.7 Advanced User Debugger (AUD) ..................................................................................... 655
Section 23 Electrical Characteristics
23.1 Absolute Maximum Ratings.............................................................................................. 657
23.2 DC Characteristics............................................................................................................. 659
23.3 AC Characteristics............................................................................................................. 663
23.4 A/D Converter Characteristics........................................................................................... 713
23.5 D/A Converter Characteristics........................................................................................... 713
Appendix A Pin Functions
A.1
A.2
22.2.1 Pin Descriptions ................................................................................................... 641
22.2.2 Block Diagram ..................................................................................................... 642
22.3.1 Bypass Register (SDBPR).................................................................................... 643
22.3.2 Instruction Register (SDIR).................................................................................. 643
22.3.3 Boundary Scan Register (SDBSR) ....................................................................... 644
22.4.1 TAP Controller..................................................................................................... 651
22.4.2 Reset Configuration.............................................................................................. 652
22.4.3 UDI Reset............................................................................................................. 653
22.4.4 UDI Interrupt........................................................................................................ 653
22.4.5 Bypass .................................................................................................................. 653
22.4.6 Using UDI to Recover from Sleep Mode ............................................................. 653
22.5.1 Supported Instructions.......................................................................................... 654
22.5.2 Points for Attention .............................................................................................. 655
23.3.1 Clock Timing........................................................................................................ 664
23.3.2 Control Signal Timing.......................................................................................... 670
23.3.3 AC Bus Timing .................................................................................................... 673
23.3.4 Basic Timing ........................................................................................................ 675
23.3.5 Burst ROM Timing .............................................................................................. 678
23.3.6 Synchronous DRAM Timing ............................................................................... 681
23.3.7 PCMCIA Timing.................................................................................................. 699
23.3.8 Peripheral Module Signal Timing ........................................................................ 706
23.3.9 UDI-Related Pin Timing ...................................................................................... 709
23.3.10 AC Characteristics Measurement Conditions....................................................... 711
23.3.11 Delay Time Variation Due to Load Capacitance.................................................. 712
Pin States ........................................................................................................................... 715
Pin Specifications .............................................................................................................. 719
................................................................................................ 715
.............................................................................. 657
............................................................... 641
Rev. 5.00, 09/03, page xxix of xliv