AT32UC3B1128-AUT Atmel, AT32UC3B1128-AUT Datasheet - Page 637

• Manufacturer Part Number: AT32UC3B1128-AUT
• Description: IC MCU AVR32 128KB FLASH 48-TQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3B1128-AUT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TQFP, 48-VQFP
• Package: 48TQFP
• Device Core: AVR32
• Family Name: AT32
• Maximum Speed: 60 MHz
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 32 Bit
• Number Of Programmable I/os: 28
• Interface Type: I2S/SPI/TWI/USART/USB
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 3
• For Use With: ATSTK600-TQFP48 - STK600 SOCKET/ADAPTER 48-TQFPATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMR770-1008 - ISP 4PORT ATMEL AVR32 MCU SPIATEVK1101 - KIT DEV/EVAL FOR AVR32 AT32UC3B
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

29. Mechanical Characteristics
29.1
29.1.1
29.1.2
32059K–03/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 29-1
Table 29-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
page
Table 29-1 on page
Consumption” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
637.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
637.
JA
)
624.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Package
TQFP64
TQFP64
TQFP48
TQFP48
AT32UC3B
Table 29-1 on
49.6
13.5
51.1
13.7
Typ
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
637